heat-sink material

简明释义

吸热材料

英英释义

例句

1.Many manufacturers now use copper as a heat-sink material due to its excellent thermal conductivity.

许多制造商现在使用铜作为散热材料，因为它具有优良的导热性。

2.Choosing the right heat-sink material is crucial for maintaining optimal temperatures in electronic devices.

选择合适的散热材料对于维持电子设备的最佳温度至关重要。

3.The computer's performance improved significantly after we replaced the old heat-sink material with a more efficient one.

在我们用更高效的散热材料替换掉旧的之后，计算机的性能显著提升。

4.In high-performance applications, the choice of heat-sink material can make a significant difference in thermal management.

在高性能应用中，散热材料的选择可以在热管理上产生重大差异。

5.The design of the CPU cooler includes a specially shaped heat-sink material to maximize airflow.

CPU散热器的设计包括一种特殊形状的散热材料，以最大化气流。

作文

In the modern world of technology, where devices are becoming increasingly compact and powerful, managing heat has become a crucial aspect of design. One key component that plays a significant role in thermal management is heat-sink material. This term refers to substances specifically engineered to absorb and dissipate heat generated by electronic components, such as processors and graphics cards. The efficiency of these materials can determine the overall performance and longevity of the devices we rely on daily.When electronic devices operate, they generate heat due to electrical resistance and energy loss. If this heat is not effectively managed, it can lead to overheating, which may cause malfunction or permanent damage to the components. This is where heat-sink material comes into play. These materials are designed to draw heat away from critical components and disperse it into the surrounding environment, thereby maintaining optimal operating temperatures.Common types of heat-sink material include metals such as aluminum and copper. Aluminum is widely used due to its lightweight nature and good thermal conductivity, making it an ideal choice for many consumer electronics. Copper, on the other hand, offers superior thermal conductivity but is heavier and more expensive. The choice between these materials often depends on the specific requirements of the device being designed, including factors such as weight, cost, and thermal performance.The design of a heat-sink material is also crucial. Engineers must consider various factors such as surface area, shape, and airflow when creating effective heat sinks. A larger surface area allows for greater heat dissipation, while a shape that promotes airflow can enhance cooling efficiency. Additionally, some advanced designs incorporate fins or other structures to maximize the surface area exposed to air, further improving the heat dissipation capabilities.In recent years, there has been significant research into new types of heat-sink material. Innovations in nanotechnology and composite materials have led to the development of substances that can outperform traditional metals in terms of thermal management. For example, materials infused with carbon nanotubes or graphene have shown promise in achieving higher thermal conductivity while being lighter and more versatile than conventional options.Moreover, the integration of heat-sink material into product design is becoming increasingly sophisticated. With the advent of smart devices and IoT (Internet of Things) technologies, managing heat effectively is essential for ensuring the reliability and performance of interconnected systems. As devices become more complex and compact, the need for advanced thermal management solutions will only grow.In conclusion, understanding heat-sink material is vital for anyone involved in electronics design and engineering. These materials not only help maintain the performance of devices but also extend their lifespan by preventing overheating. As technology continues to evolve, so too will the materials and methods used in thermal management. By staying informed about advancements in heat-sink material, engineers can ensure that their designs remain efficient, reliable, and cutting-edge in an ever-competitive market.

在现代科技世界中，随着设备变得越来越紧凑和强大，热量管理已成为设计中的一个关键方面。一个在热管理中发挥重要作用的关键组件是散热材料。这个术语指的是专门设计用来吸收和散发电子元件（如处理器和显卡）产生的热量的物质。这些材料的效率可以决定我们日常依赖的设备的整体性能和寿命。当电子设备运行时，由于电阻和能量损失，它们会产生热量。如果这些热量没有有效管理，可能会导致过热，从而导致元件故障或永久性损坏。这就是散热材料的作用所在。这些材料旨在将热量从关键元件中引走，并将其散发到周围环境中，从而保持最佳的工作温度。常见的散热材料包括铝和铜等金属。铝因其轻便和良好的导热性被广泛使用，使其成为许多消费电子产品的理想选择。而铜则提供了更优越的导热性，但重量更大，成本也更高。在选择这些材料时，通常取决于所设计设备的具体要求，包括重量、成本和热性能等因素。散热材料的设计也至关重要。工程师在创建有效的散热器时必须考虑各种因素，如表面积、形状和气流。此外，某些先进设计还采用鳍片或其他结构，以最大化暴露于空气中的表面积，从而进一步提高散热能力。近年来，针对新型散热材料的研究取得了显著进展。纳米技术和复合材料的创新促使开发出在热管理方面能超越传统金属的物质。例如，掺有碳纳米管或石墨烯的材料在实现更高导热性的同时，具有更轻和更具多功能性的优势。此外，将散热材料集成到产品设计中变得越来越复杂。随着智能设备和物联网（IoT）技术的出现，有效管理热量对于确保互联系统的可靠性和性能至关重要。随着设备变得更加复杂和紧凑，对先进热管理解决方案的需求只会增加。总之，理解散热材料对任何参与电子设计和工程的人来说都是至关重要的。这些材料不仅帮助维持设备的性能，还通过防止过热延长其使用寿命。随着科技的不断发展，热管理中使用的材料和方法也将不断演变。通过了解散热材料的进步，工程师可以确保他们的设计在竞争激烈的市场中保持高效、可靠和前沿。