heat dissipation capacity

简明释义

散热量

英英释义

例句

1.The heat dissipation capacity 散热能力 of the heat sink is crucial for maintaining optimal temperatures.

散热器的散热能力对于维持最佳温度至关重要。

2.The new cooling system significantly improves the heat dissipation capacity 散热能力 of the server room.

新的冷却系统显著提高了机房的散热能力。

3.A higher heat dissipation capacity 散热能力 allows for better performance in high-load applications.

更高的散热能力允许在高负载应用中获得更好的性能。

4.To prevent overheating, the device's heat dissipation capacity 散热能力 must be sufficient.

为了防止过热，设备的散热能力必须足够。

5.Engineers must consider the heat dissipation capacity 散热能力 of materials when designing electronic devices.

工程师在设计电子设备时必须考虑材料的散热能力。

作文

In the modern world, technology plays a crucial role in our daily lives. From smartphones to computers, electronic devices have become indispensable. However, with the advancement of technology comes the challenge of managing heat produced by these devices. Herein lies the importance of understanding and optimizing heat dissipation capacity (热散发能力). This term refers to the ability of a material or device to dissipate heat effectively into the surrounding environment, ensuring that it operates within safe temperature limits.The heat dissipation capacity is particularly significant in high-performance electronics, such as gaming computers and servers. These devices generate substantial amounts of heat during operation, and if this heat is not managed properly, it can lead to overheating, reduced performance, and even permanent damage. Therefore, engineers and designers must consider the heat dissipation capacity of the materials they use and the overall design of the device.One common method to enhance heat dissipation capacity is through the use of heat sinks. A heat sink is a passive component that absorbs and disperses heat away from critical components. By increasing the surface area that is exposed to the air, heat sinks can significantly improve the heat dissipation capacity of a device. Additionally, active cooling solutions, such as fans and liquid cooling systems, can further assist in managing heat by actively moving air or liquid around the heat-generating components.Another factor influencing heat dissipation capacity is the choice of materials. Materials with high thermal conductivity, such as copper and aluminum, are often used in the construction of heat sinks and other cooling components. These materials allow heat to flow away from the source quickly, enhancing the overall heat dissipation capacity of the system. On the other hand, insulative materials can trap heat, leading to increased temperatures and potential failure.Moreover, the design of the electronic device itself can impact its heat dissipation capacity. For instance, creating adequate airflow within a computer case is essential for maintaining optimal temperatures. Designers must ensure that there are sufficient vents and pathways for air to circulate freely, preventing hot spots from forming. Additionally, the layout of components on a circuit board can also affect how heat is distributed and dissipated.In conclusion, the heat dissipation capacity (热散发能力) of electronic devices is a critical aspect that must be carefully considered during the design and manufacturing processes. As technology continues to evolve and devices become more powerful, the need for effective heat management will only increase. By understanding and optimizing the heat dissipation capacity, we can ensure that our electronic devices operate efficiently and reliably, ultimately enhancing our user experience and extending the lifespan of our technology. The future of electronics depends on our ability to manage heat effectively, making heat dissipation capacity an essential concept in the field of engineering and design.

在现代世界，技术在我们日常生活中扮演着至关重要的角色。从智能手机到计算机，电子设备已成为不可或缺的。然而，随着技术的进步，管理这些设备产生的热量也成为了一项挑战。在这里，理解和优化热散发能力（heat dissipation capacity）的重要性显而易见。这个术语指的是材料或设备将热量有效散发到周围环境中的能力，确保其在安全温度范围内运行。热散发能力在高性能电子设备中尤其重要，例如游戏电脑和服务器。这些设备在工作过程中会产生大量热量，如果热量没有得到妥善管理，就可能导致过热、性能下降甚至永久性损坏。因此，工程师和设计师必须考虑他们所使用材料的热散发能力以及设备的整体设计。增强热散发能力的一种常见方法是使用散热器。散热器是一种被动组件，可以吸收并分散来自关键组件的热量。通过增加暴露于空气的表面积，散热器可以显著提高设备的热散发能力。此外，主动冷却解决方案，如风扇和液体冷却系统，也可以通过主动移动空气或液体来进一步帮助管理热量，防止过热。影响热散发能力的另一个因素是材料的选择。具有高热导率的材料，例如铜和铝，通常用于散热器和其他冷却组件的制造。这些材料允许热量迅速从源头流出，从而增强系统的整体热散发能力。另一方面，绝缘材料则可能会困住热量，导致温度升高和潜在故障。此外，电子设备本身的设计也会影响其热散发能力。例如，在计算机机箱内创造足够的气流对于保持最佳温度至关重要。设计师必须确保有足够的通风口和空气自由流动的通道，以防止形成热点。此外，电路板上组件的布局也会影响热量的分布和散发。总之，电子设备的热散发能力（heat dissipation capacity）是一个关键方面，在设计和制造过程中必须仔细考虑。随着技术的不断发展，设备变得越来越强大，对有效热管理的需求只会增加。通过理解和优化热散发能力，我们可以确保电子设备高效可靠地运行，最终提升用户体验并延长技术的使用寿命。电子产品的未来依赖于我们有效管理热量的能力，使得热散发能力成为工程和设计领域的一个重要概念。