heat dissipation

简明释义

热发散

英英释义

例句

1.The design of the computer case is critical for effective heat dissipation 散热 to prevent overheating.

计算机机箱的设计对于有效的散热至关重要，以防止过热。

2.Fans are commonly used in devices to enhance heat dissipation 散热 during operation.

风扇常用于设备中，以增强操作过程中的散热。

3.Engineers often use thermal paste to improve heat dissipation 散热 between the CPU and the heatsink.

工程师们常常使用导热膏来改善CPU与散热器之间的散热效果。

4.In electronics, proper heat dissipation 散热 can extend the lifespan of components.

在电子产品中，适当的散热可以延长组件的使用寿命。

5.The heat dissipation 散热 performance of a material can greatly affect its suitability for various applications.

材料的散热性能会极大影响其在各种应用中的适用性。

作文

In our modern world, technology plays a crucial role in various aspects of our lives. One of the most significant challenges faced by engineers and designers is managing heat generated by electronic devices. This phenomenon, known as heat dissipation, refers to the process by which excess heat is released from a system into its surroundings. Understanding heat dissipation is essential for ensuring the efficiency and longevity of electronic components. When electronic devices operate, they generate heat due to electrical resistance and energy loss. If this heat is not effectively managed, it can lead to overheating, which may cause malfunctions or permanent damage to the device. Therefore, engineers must implement various strategies to enhance heat dissipation. One common method used to improve heat dissipation is the incorporation of heat sinks. These are typically made of materials with high thermal conductivity, such as aluminum or copper. Heat sinks absorb heat from the device and disperse it into the air, thereby reducing the temperature of the component. The design of heat sinks can vary greatly, with some featuring fins or other structures that increase their surface area, allowing for more efficient heat dissipation. Another effective technique for promoting heat dissipation is the use of fans or cooling systems. Fans create airflow around the device, which helps to carry away heat. In more advanced applications, liquid cooling systems are employed, where coolant circulates through the device, absorbing heat and transferring it away to a radiator or cooling unit. Both methods significantly enhance heat dissipation, preventing overheating and ensuring optimal performance. Moreover, the choice of materials used in electronic devices can also impact heat dissipation. Engineers often select materials that not only conduct electricity well but also have good thermal properties. For instance, using ceramic substrates can improve heat dissipation in certain applications. Additionally, the layout of components on a circuit board can affect how heat spreads throughout the device, making strategic placement essential for effective heat dissipation. As technology continues to advance, the need for efficient heat dissipation solutions becomes even more critical. With the rise of compact and powerful devices, such as smartphones and laptops, managing heat becomes increasingly complex. Engineers must continually innovate and develop new methods to address these challenges. In conclusion, heat dissipation is a fundamental concept in the design and operation of electronic devices. By understanding and implementing effective heat dissipation strategies, engineers can ensure that devices operate safely and efficiently. As technology evolves, the importance of managing heat will only grow, highlighting the need for ongoing research and development in this essential area of engineering.

在我们现代世界中，技术在生活的各个方面都发挥着至关重要的作用。工程师和设计师面临的一个重大挑战是管理电子设备产生的热量。这种现象被称为热散失，指的是多余的热量从系统释放到其周围环境的过程。理解热散失对于确保电子元件的效率和使用寿命至关重要。当电子设备运行时，由于电阻和能量损失，它们会产生热量。如果这种热量没有得到有效管理，就可能导致过热，从而造成设备故障或永久性损坏。因此，工程师必须实施各种策略来增强热散失。提高热散失的常见方法之一是结合散热器。这些通常由导热性高的材料制成，如铝或铜。散热器吸收来自设备的热量并将其散发到空气中，从而降低组件的温度。散热器的设计可以有很大不同，有些具有翅片或其他结构，以增加其表面积，从而允许更有效的热散失。促进热散失的另一种有效技术是使用风扇或冷却系统。风扇在设备周围产生气流，帮助带走热量。在更高级的应用中，采用液体冷却系统，其中冷却液通过设备循环，吸收热量并将其转移到散热器或冷却单元。这两种方法显著增强了热散失，防止过热并确保最佳性能。此外，电子设备中所用材料的选择也会影响热散失。工程师通常选择不仅导电良好且具有良好热性能的材料。例如，在某些应用中使用陶瓷基板可以改善热散失。此外，电路板上组件的布局也会影响热量如何在设备中传播，因此战略性地放置组件对有效的热散失至关重要。随着技术的不断进步，对高效热散失解决方案的需求变得更加迫切。随着紧凑型和强大设备（如智能手机和笔记本电脑）的兴起，管理热量变得越来越复杂。工程师必须不断创新，开发新方法来应对这些挑战。总之，热散失是电子设备设计和操作中的基本概念。通过理解和实施有效的热散失策略，工程师可以确保设备安全高效地运行。随着技术的发展，管理热量的重要性只会增加，这突显了在这一关键工程领域持续研究和开发的必要性。