extra large scale integration

简明释义

特大规模集成

英英释义

例句

1.With extra large scale integration, engineers can create more complex systems on smaller boards.

通过超大规模集成，工程师可以在更小的电路板上创建更复杂的系统。

2.The new microprocessor was developed using extra large scale integration technology, which allows for more transistors on a single chip.

新微处理器采用了超大规模集成技术开发，这使得单个芯片上可以容纳更多的晶体管。

3.In the field of electronics, extra large scale integration is crucial for creating compact and powerful devices.

在电子领域，超大规模集成对于制造紧凑而强大的设备至关重要。

4.The shift towards extra large scale integration has revolutionized the way we design circuits.

向超大规模集成的转变彻底改变了我们设计电路的方式。

5.Companies are investing heavily in extra large scale integration to improve performance and reduce costs.

公司正在大量投资于超大规模集成以提高性能并降低成本。

作文

The advancement of technology has led to significant changes in the way we design and manufacture electronic devices. One of the most notable developments in this field is the concept of extra large scale integration, which refers to the process of integrating an extremely high number of transistors onto a single chip. This innovation has revolutionized the electronics industry, allowing for the creation of more powerful and compact devices. In this essay, I will explore the implications of extra large scale integration on modern technology, its advantages, and some challenges that come with it.Firstly, the primary advantage of extra large scale integration is the significant reduction in size and cost of electronic components. By integrating millions or even billions of transistors on a single chip, manufacturers can produce smaller devices that consume less power and require fewer materials. This has led to the miniaturization of devices such as smartphones, laptops, and tablets, making them more portable and user-friendly. Additionally, the reduced cost of production allows companies to offer these devices at competitive prices, making technology accessible to a broader audience.Moreover, extra large scale integration has enhanced the performance of electronic devices. With more transistors available on a single chip, it is possible to execute complex calculations and processes at much higher speeds. This has been crucial for the development of advanced applications such as artificial intelligence, machine learning, and high-performance computing. For example, modern graphics processing units (GPUs) rely heavily on extra large scale integration to deliver stunning visuals and smooth gaming experiences.However, despite its many benefits, extra large scale integration also presents several challenges. One of the primary concerns is heat dissipation. As more transistors are packed into a smaller area, the heat generated during operation increases significantly. If not managed properly, this can lead to overheating and potential failure of the device. Engineers and designers must therefore develop innovative cooling solutions to ensure that devices remain functional and reliable.Another challenge associated with extra large scale integration is the complexity of design and manufacturing. Creating a chip that incorporates millions of transistors requires sophisticated design tools and a deep understanding of semiconductor physics. The process is not only time-consuming but also costly, as any errors in design can lead to expensive rework and delays in production. This necessitates a highly skilled workforce capable of navigating the intricacies of modern chip design.In conclusion, extra large scale integration has had a profound impact on the electronics industry, enabling the production of smaller, faster, and more efficient devices. While it offers numerous advantages, it also brings forth challenges that must be addressed to fully harness its potential. As technology continues to evolve, the role of extra large scale integration will undoubtedly remain central to the development of future innovations, shaping the way we interact with the digital world.

随着技术的进步，电子设备的设计和制造方式发生了显著变化。在这一领域中，一个最显著的发展就是“超大规模集成”的概念，它指的是将极高数量的晶体管集成到单个芯片上的过程。这一创新彻底改变了电子行业，使得更强大、更紧凑的设备得以创造。在这篇文章中，我将探讨“超大规模集成”对现代技术的影响、它的优势以及伴随而来的挑战。首先，“超大规模集成”的主要优势是显著降低了电子元件的尺寸和成本。通过在单个芯片上集成数百万甚至数十亿个晶体管，制造商可以生产出更小的设备，这些设备消耗更少的电力并且所需材料更少。这导致了智能手机、笔记本电脑和平板电脑等设备的小型化，使其更便携且用户友好。此外，生产成本的降低使得公司能够以具有竞争力的价格提供这些设备，从而使技术能够被更广泛的人群所接受。此外，“超大规模集成”还增强了电子设备的性能。由于在单个芯片上可用的晶体管数量增加，可以以更高的速度执行复杂的计算和处理。这对人工智能、机器学习和高性能计算等先进应用的发展至关重要。例如，现代图形处理单元（GPU）在很大程度上依赖于“超大规模集成”来提供惊人的视觉效果和流畅的游戏体验。然而，尽管有许多好处，“超大规模集成”也带来了若干挑战。其中一个主要问题是热量散发。随着越来越多的晶体管被压缩到更小的区域，运行过程中产生的热量显著增加。如果管理不当，这可能导致过热和设备故障。因此，工程师和设计师必须开发创新的冷却解决方案，以确保设备保持功能和可靠性。与“超大规模集成”相关的另一个挑战是设计和制造的复杂性。创建一个集成数百万个晶体管的芯片需要复杂的设计工具和对半导体物理的深刻理解。这个过程不仅耗时，而且成本高昂，因为设计中的任何错误都可能导致昂贵的返工和生产延误。这就需要一支高技能的劳动力，能够应对现代芯片设计的复杂性。总之，“超大规模集成”对电子行业产生了深远的影响，使得更小、更快、更高效的设备得以生产。虽然它提供了许多优势，但也带来了必须解决的挑战，以充分利用其潜力。随着技术的不断发展，“超大规模集成”的作用无疑将继续在未来创新的发展中占据中心地位，塑造我们与数字世界的互动方式。