sputtering target

简明释义

溅射靶

英英释义

例句

1.The scientist adjusted the settings on the machine to optimize the performance of the sputtering target.

科学家调整了机器的设置，以优化溅射靶的性能。

2.When the sputtering target was replaced, the experiment yielded much better results.

当溅射靶被更换后，实验的结果大大改善。

3.The quality of the coating depends heavily on the type of sputtering target used.

涂层的质量在很大程度上依赖于所使用的溅射靶类型。

4.The research team studied the effects of different materials on the performance of the sputtering target.

研究小组研究了不同材料对溅射靶性能的影响。

5.After several trials, they found the ideal sputtering target for their application.

经过几次试验，他们找到了适合其应用的理想溅射靶。

作文

In the realm of physics and engineering, the term sputtering target refers to a material that is bombarded by energetic particles, typically ions, which leads to the ejection of atoms from its surface. This process is crucial in various applications, including thin film deposition, surface analysis, and even in the manufacturing of semiconductors. The concept of a sputtering target is not only significant in scientific research but also plays a vital role in modern technology. Understanding the mechanics behind a sputtering target involves delving into the principles of sputtering itself. When ions collide with the target material, they transfer energy, causing some atoms on the target's surface to become dislodged. These ejected atoms can then condense onto a substrate, forming a thin film. This technique is widely used in the production of coatings for tools, optical devices, and electronic components. The effectiveness of a sputtering target depends on several factors, including the nature of the target material, the energy of the incident ions, and the angle of incidence. For instance, metals like titanium and aluminum are commonly used as targets due to their favorable physical properties. Additionally, the choice of gas used for ionization can influence the sputtering yield, which is the number of atoms ejected per incident ion. In practical applications, the design and composition of a sputtering target can greatly affect the quality and characteristics of the deposited films. Researchers and engineers must carefully select materials that will provide the desired electrical, optical, or mechanical properties in the final product. For example, a sputtering target made from a specific alloy may be chosen to enhance the conductivity of a semiconductor layer, while a ceramic target might be used to achieve a hard, wear-resistant coating. Moreover, advancements in technology have led to the development of novel sputtering target materials and techniques, such as reactive sputtering, where the target material reacts with a gaseous reactant to form a compound on the substrate. This method has opened new avenues for creating complex materials with tailored properties, which are essential in cutting-edge applications like photovoltaics and catalysis. Furthermore, the environmental impact of sputtering target production and usage is an area of growing concern. Manufacturers are increasingly looking for sustainable practices, including the recycling of target materials and the reduction of waste during the sputtering process. By innovating in this field, we can ensure that the benefits of sputtering technology do not come at the expense of our planet. In conclusion, the concept of a sputtering target is integral to the fields of material science and engineering. Its applications span across various industries, contributing to the advancement of technology and the enhancement of product performance. As we continue to explore and innovate within this domain, the understanding of sputtering targets will undoubtedly evolve, paving the way for new technologies and solutions to meet the demands of the future.

在物理和工程领域，短语sputtering target指的是一种被高能粒子（通常是离子）轰击的材料，这一过程导致其表面原子的弹射。这个过程在各种应用中至关重要，包括薄膜沉积、表面分析，甚至半导体制造。sputtering target的概念不仅在科学研究中具有重要意义，而且在现代技术中也发挥着至关重要的作用。理解sputtering target背后的机制需要深入探讨溅射本身的原理。当离子与靶材碰撞时，它们会转移能量，导致靶材表面的一些原子脱落。这些被弹射的原子随后可以在基材上凝结，形成薄膜。这种技术广泛用于工具、光学设备和电子元件的涂层生产。sputtering target的有效性取决于多个因素，包括靶材的性质、入射离子的能量和入射角度。例如，钛和铝等金属因其有利的物理特性而常被用作靶材。此外，所使用的离子化气体的选择也会影响溅射产率，即每个入射离子弹射的原子数量。在实际应用中，sputtering target的设计和成分可以极大地影响沉积薄膜的质量和特性。研究人员和工程师必须仔细选择材料，以提供最终产品所需的电气、光学或机械性能。例如，特定合金制成的sputtering target可能被选择以提高半导体层的导电性，而陶瓷靶可能被用于实现硬质耐磨涂层。此外，技术的进步导致了新型sputtering target材料和技术的发展，例如反应溅射，其中靶材与气态反应物反应，在基材上形成化合物。这种方法为创造具有定制特性的复杂材料开辟了新途径，这在光伏和催化等前沿应用中至关重要。此外，sputtering target的生产和使用对环境的影响日益受到关注。制造商越来越多地寻求可持续的做法，包括回收靶材和减少溅射过程中的废物。通过在这一领域进行创新，我们可以确保溅射技术的好处不会以牺牲我们星球为代价。总之，sputtering target的概念对于材料科学和工程领域至关重要。它的应用遍及各个行业，为技术进步和产品性能提升做出了贡献。随着我们继续探索和创新这一领域，对sputtering target的理解无疑会不断发展，为未来的技术和解决方案铺平道路。